TI events

New Product Update: TPS482H85-Q1 2ch high-side switch for 48V automotive & industrial systems

Discover TI's new TPS482H85-Q1: A 2-channel, 58V, 85mΩ high-side switch for 48V systems. Learn about its robust protection features and versatile applications in automotive and industrial markets. Perfect for driving 48V loads with its transient protection up to 80V.

RADECS Conference

Learn more about our portfolio of high-reliability, rad-hard and rad-tolerant products at Booth 28 or during the three TI-hosted topics in the Data Workshop on Thursday, 2 October.

Building smarter, safer humanoids for the future

Humanoid robots are here—and TI is powering them. Join our webinar to see how our processors, sensors, power and communication solutions are already designed into leading platforms, enabling intelligence, safety and scale in real-world applications.

AutoSens and InCabin Europe 2025

Come visit the TI booth #203, where we will be showcasing our latest automotive demos and speaking at the conference. 

• Panel Discussion - Redefining In-Cabin Safety: The Next Generation of Interior Sensing
• Roundtable Discussion - Radar and camera fusion for in-cabin safety functions

Battery Managment Solutions (BMS) Seminar

Join us at BMS to explore battery management solutions with TI experts. Attend sessions on industry trends and technical challenges, and tailor your experience with topics like protectors, monitors, gauges, and chargers.

Mastering High power density flyback for USB-PD Webinar

Explore how TI's self-biasing technology transforms USB-PD Flyback adapters, eliminating transformer aux winding while delivering superior efficiency and power density. Learn essential design techniques to optimize performance, reduce component count, and cut costs.

Overview of TI's CAN + LIN SBC family and it's possible applications

Learn how TI's SBCs maximize efficiency in automotive and industrial applications with integrated CAN+LIN transceivers, power regulators, and logic features—all in one package. Solve your space, power, and cost challenges with these versatile solutions.

Open Compute Project (OCP) Global Summit

Join us to see how you can achieve more power in smaller spaces with our innovative power management technologies for Common Redundant Power Supply (CRPS) and open rack server power supply units (PSUs), battery back-up units, 48V AI servers and point-of-load (POL) applications. 

New Product Update: High-Performance PGAs for Superior Signal Fidelity

Discover how TI's new PGA family delivers high SNR, fast settling, and flexible gain for demanding applications. Learn to solve wide input signal challenges while maintaining fidelity in lab instruments, medical devices, and industrial systems.

Prototype to Product: Getting Started with TI's Open Source Development Platform for EV Chargers

Join our webinar to discover how to simplify EV charging designs across all regions with TI’s open-source development platform. See how AM62L and MSPM0 technologies handle multiple protocols and can help you scale from basic charging to advanced V2G applications.

Space Tech Expo Europe

Learn more about how our high-reliability, rad-hard and rad-tolerant analog and embedded processing products can help you achieve space-grade certification faster at hall 5, booth Q35.

TI Embedded Labs 2025

This event offers expert sessions on embedded processing including cybersecurity, edge AI, signal processing, wireless solutions, motor control, regulatory compliance, and zero-code development tools. Join industry leaders virtually or in person to advance your expertise in embedded technologies.

Power Supply Design Seminar (PSDS)

The Power Supply Design Seminar (PSDS) series provides technical training on new advanced power supply concepts, basic design principles, and "real-world" application examples. The topics presented will be worthwhile for all levels of expertise. Each seminar is offered at 8 a.m. CDT and 8 p.m. CDT.

electronica India 2025

Join us in Bengaluru, where we will be showcasing our latest demonstrations highlighting our comprehensive portfolio of embedded and analog products designed to address challenges in automotive, energy infrastructure and appliances industries.

Learn about AM335x and the new BeagleBone® Green Eco

Explore the cost-effective BeagleBone Green Eco featuring TI's AM335x and optimized PMIC. Join our expert to learn how this solution addresses development challenges and fits within TI's Sitara MPU portfolio, with tools to accelerate your time to market.

TI Precision Labs Seminar 2025 Taiwan

Join our industry experts as they guide you through various topics, and become an expert yourself. TI Precision Labs (TIPL) is the most comprehensive classroom for analog signal chain designers that covers everything from foundational knowledge to advanced concepts.

Multi-protocol industrial communication: Empowering next-generation industrial automation

As factory automation evolves, the need for real-time and standards-compliant industrial communication has never been more critical. Learn how TI’s advanced Industrial Communications Subsystem helps simplify system design and reduce time-to-market without compromising performance or compliance.

TI Precision Labs Seminar 2025 Japan

Join our industry experts as they guide you through various topics, and become an expert yourself. TI Precision Labs (TIPL) is the most comprehensive classroom for analog signal chain designers that covers everything from foundational knowledge to advanced concepts.

New Product Update: Lighting up the Modern Industrial HMI

Discover how merging HMI and control functions transforms system architectures for efficiency. Learn about silicon accelerators powering advanced applications, and explore tactics to optimize GPU performance with Linux and RTOS for maximum responsiveness in your designs.

TI Arm® Cortex®-M0+ MCUs: Unlock the potential of your next automotive design

TI's automotive-qualified Arm® Cortex®-M0+MCUs deliver reliable, efficient control for automotive electronics at competitive costs. Learn why MSPM0 MCUs are ideal for automotive designs and how to speed up your development with practical resources.

Addressing ground offset challenges using TI’s ground-level translators

Introducing TI’s new family of ground-level translators and industry’s first portfolio of devices that enables seamless communication between systems by accommodating ground shift in <80V non-galvanic systems; allowing engineers to design a more compact, cost-effective and faster solution.

New Product Update: High-Voltage Difference Amplifier with Attenuation Ratios for Voltage Monitoring

In this webinar, we will introduce Texas Instrument's latest innovation in our Difference Amplifier targeted for Voltage Sensing in growing markets within the industry. The INA600 is a Difference Amplifier that can directly monitor voltages up to 85V while being powered off a supply as low as 5.5V!  

Indonesia Seminar

Join Texas Instruments for an exclusive two-day technical seminar and hands-on workshop in Jakarta this August, where you'll discover cutting-edge semiconductor solutions that can accelerate your designs.

New Product Update: TI's Enhanced MSPM0C MCU Series for Streamlined System Design

TI's low-cost MCU MSPM0C series now expand to 48pin 64KB, with small packages available as always. It can help reduce the system size as well as the cost. How to simplify your system design with MSPM0C with ready-to-go code library and hardware design.

Small Satellite Conference

Learn more about our portfolio of high-reliability, rad-hard and rad-tolerant products and view our latest demos at booth 1133 or join us at poster session #2 on Tuesday, August 12.

New Product Update: Enabling higher power density and reliability in automotive with new LLC

Learn how advanced LLC controllers like UCC25661(Q1) enable efficient power solutions for EV/HEV systems. Explore LLC topology basics, control methods, and applications in vehicle power supplies and charging systems to maximize range while reducing costs.

New Product Update: Next-Gen Processor Power Design: TPS546E25 Solutions

Discover how TPS546E25 DC/DC converters solve power challenges for high-current processors. Learn about PMBus features, design tools, and solutions delivering up to 200A with parallel stacking. Master an efficient and high-density power design for FPGA, CPU, GPU, and ASIC applications.

New Product Update: AM263P MCU delivered with flash-in-package

Explore the AM263P-SIP MCU with integrated flash-in-package and ethernet switch. Perfect for zone controllers and BMS, it delivers multi-core ARM performance and enables scalable architectures for Software Defined Vehicles.

NSREC (IEEE Nuclear & Space Radiation Effects) Conference 2025

Join us at NSREC 2025 in booth 406, where we will be showcasing our latest space demos and speaking at five sessions in the radiation effects data workshop on Thursday, 17 July.

International Microwave Symposium (IMS)

Learn about the latest technologies for RF amplifiers, data converters, clocks and RF transceivers in booth 355.

Innovations in laser driving technology

Explore this breakthrough technology in the world of laser driving. We will introduce a new high-speed integrated laser driver that marries ultra-precise current control with advanced integration, enabling unprecedented accuracy and speed in object detection at a reduced solution size.

MSP430 to MSPM0 MCUs: All you need to know before you migrate

Walk through the software migration process from MSP430 to MSPM0 MCUs with TI and IAR. We’ll cover key differences in architecture, peripheral mapping and how to carry over existing code. With IAR’s flexible model see how you can keep development moving while migrating at your own pace.

Enhancing motor control in robotics with functionally isolated current sensing technology

Robots are becoming more capable than ever before, driving the need for higher levels of precision and reliability. Join this webinar to learn about our new functionally isolated current and voltage sensing technology that is enabling these advanced capabilities with more precise motor control.

Korea TI Automotive Seminar

The 2025 TI Automotive Seminar will showcase the latest automotive design trends, including SDV and zone architecture, 48V automotive systems, and HEV/EV powertrain, along with TI innovations and solutions.

Zero code required: graphically develop with MSPM0 MCUs

MSP Zero Code Studio is a visual design environment that enables users to configure their MCU, develop an application, compile code and program the MCU all from a single GUI. Join our webinar to learn how you can simplify application code creation from hours down to minutes.

PCIM Expo & Conference 2025

Visit us at PCIM 2025 and see how we are pushing the limits of power with our latest power management innovations.

TI Precision Labs Seminar 2025 Detroit

Join our industry experts as they guide you through various topics, and become an expert yourself. TI Precision Labs (TIPL) is the most comprehensive classroom for analog signal chain designers that covers everything from foundational knowledge to advanced concepts.

Advancing the next-generation satellite power architecture

Join the webinar to learn about our new product family of GaN FET gate drivers with devices ranging from 22V to 200V, and our latest 300W isolated full bridge reference design using a novel zero-voltage switching topology.

Enhancing HMI experience on Arm-based processors with lightweight graphics libraries

Join us for a webinar where we will explore how TI processors, combined with LVGL, can enable smooth, high-performance graphical applications. This session will provide practical insights on how to streamline your GUI development process. 

Part 2: Next-generation server power designs with integrated GaN technology

Join this webinar session, where TI experts will dive deeper into server PSU designs, including topology comparisons and a quick recap on how AI data center power designs are moving between generations due to ever-increasing power needs.

Taiwan TI Automotive Seminar

Texas Instruments hosted the TI Smart Automotive Symposium on April 16 to bring forward-looking technology sharing on topics such as ADAS, Electric Vehicle Power and Automotive LED Control to help you understand future automotive electronics design trends. and inspire your innovative designs. 

Understanding the transition from 12V to 48V in electric vehicles

As 48V Battery Electric Vehicles (BEV) are being introduced to the market, many global carmakers are considering transitioning from 12V to 48V within their automotive systems. This presentation will outline the benefits, challenges and potential design solutions for 48V in future EVs.

2025 TI Tech Day Thailand

In-person seminar on April 8th in Bangkok, Thailand. Technical experts are invited to share the product's latest key functions and applications. The sessions will focus on processor, wireless technology, fundamental Power knowledge, and TI’s interface solutions. 

APEC - Applied Power Electronics Conference

Visit us at APEC 2025 to reimagine power density and efficiency

How to develop display-based systems with a unified processor portfolio

TI's portfolio of Arm-based processors help streamline the development of display-based applications. We will explore key applications, common design challenges and how our processors simplify development, reduce time to market and optimize performance across multiple use cases.

TI Precision Labs Virtual Seminars

TI Precision Labs (TIPL) is a comprehensive classroom for analog signal chain designers that covers everything from foundational knowledge to advanced concepts. These seminars will deepen the technical expertise of experienced engineers and accelerate the development of those early in their careers.

embedded world 2025

Reimagine embedded systems with edge AI and connectivity technologies! Come by the TI booth in Hall 3A, booth 131 to see how.

Next-generation server power designs with integrated GaN technology

AI is pushing data centers to their limits, creating complex design challenges in thermal management and power efficiency. Join TI's experts to discover how GaN technology transforms server power architectures, overcoming thermal barriers and meeting next-generation computing demands.

CES 2025

Visit us at CES to see how through perception and edge AI technologies, we’re helping you reimagine everything from vehicles to robots to personal electronics.Let’s reimagine future experiences together.

Ignite innovation with intelligent sensing

This webinar delves into the role of intelligent sensing, focusing on mmWave radar technology. Learn how this technology enhances device intelligence, allowing for more reliable and nuanced interactions with the environment, enhanced privacy, and better user experiences.

The benefits of GaN for solar inverters

With the increase in demand for hybrid solar inverters, the need for smaller, lighter power converter solutions is continuing to grow. Learn how to bring improvements in power density, efficiency and thermal design for mid-voltage systems with TI's integrated GaN power stages. 

Redefine your procurement journey with new self-service e-commerce features

Today's procurement experience can be overloaded with support tickets and long wait times. Join us as TI eCommerce leaders share new self-service buying features that redefine your procurement journey by providing you with enhanced control and instant access to ordering data for you and your team.

The smallest package TI MSPM0 MCU enables room to do more in your design

As we enter an era defined by space-efficient devices, MSPM0C1104 enables engineers to craft smaller and smarter products. Get an inside look as to how the MSPM0C MCU's can be leveraged to optimize cost and board space on any design.

Packaging innovations for space applications

Do you want to optimize your new space applications by learning about the latest packaging types and corresponding qualification classes? Join us as we explain the differences between -SEP (Space Enhanced Products), QML-P and QML-Y and how these compare to the long existing QML-V class of products. 

Accelerating 5G Open RAN interoperability with a complete radio development platform

Join experts from TI, Intel and Hitek Systems as they discuss how TI’s AFE7769D multi-band analog front-end radio-frequency (RF) transceiver solution and Hitek’s Agilex embedded system on module (eSOM7) development platform ease the design and deployment of Intel-based O-RAN architectures for LTE, 5G and other wireless communications systems with greater interoperability and performance.

Wireless Technologies for Solar Microinverters and Trackers

Join us as our TI experts discuss how  different wireless technologies can be used with solar panels and the benefits of each of them. In this webinar, you will learn how TI's newest SDK is addressing network formation time and helping manufacturers during fabrication, installation and maintenance processes.

Clocking solutions for datacenters

Join us for our live webinar where we will discuss clocking solutions for datacenters along with their various applications. We will also explore bulk acoustic wave (BAW) resonator technology and how it can bring reliability, ultra-low jitter, and flexibility to your design.

Solving functional safety challenges in robotics motor control systems

Designers have two primary goals when building a robot motor control system: accurate functioning and optimizing the functional safety requirements of their design. Join us as we discuss how TI's latest IC innovations helps to solve these key design challenges and function safety considerations.

Wie bereiten Sie sich auf den nächsten Halbleiterzyklus vor

TI erweitert seine Fertigungskapazitäten, um Ihre aktuellen und zukünftigen Produktanforderungen zu erfüllen. Erfahren Sie, wie die neuesten E-Commerce-Funktionen von TI Ihnen den Kauf Ihrer Produkte bei uns erleichtern. Melden Sie sich noch heute an, um Ihre Anmeldedaten zu erhalten und jederzeit teilzunehmen. 

HVAC heat pump system controllers: Part 3

Check out and learn how our latest AM62x and AM625SIP processors support HVAC systems, thermostats and controllers help accelerate your time to market in both hardware, software, and security.

Integrating functional safety compliance

TI functional safety expert explores why the typical design process for motor applications often results in development challenges.

Common mistakes in power supplies: Part 2

In this part-2 session, co-hosted with Altium Designer, we will discuss the design guidelines for GaN devices that help power-supply designers maximize the benefits delivered by GaN technology.

Solution for tomorrow's energy conversion systems

Introducing the latest addition to the C2000 real-time MCU portfolio, TMS320F28F65x; helping make real-time technology innovative with new PWM generation, new analog capabilities and more integration.

Modernizing factories with real-time communication

Today’s factories face the challenge of processing vast amounts of data quickly, securely, and without interruptions. This webinar explores various protocols and their impact on factories. 

Embedded development with the TI Developer Zone

All in one place, learn how you can easily evaluate, develop and debug code on your desktop or the cloud with TI Developer Zone - a comprehensive environment of software, tools and training.

System solutions for In-Vitro Diagnostics applications

Tune into our webinar and learn about how TI’s signal chain components help achieve best-in-class performance and solve design challenges of in-vitro diagnostics (IVD) applications.

HVAC Heat pump motor drives: Part 2

Efficient compressor and condenser fan motor drive design, this session focuses on the resources and references available to develop control systems for heat pumps or air conditioners.

Battery Management Solutions Seminar

View content on demand from this 2-day seminar to learn more about the latest trends in battery management chargers, gauges, monitors and protectors.

Rad-hard low-noise linear regulator for high-performance satellite sensing and communications systems

Learn about space-grade power solutions to help you reach lower levels of noise than previously available in the space market.

Enable MSPM0 low-cost MCUs for building automation and home healthcare

Enable TI’s new MSPM0 low-cost MCUs for building automation and home healthcare applications. Discover analog and computing requirements, cost reductions at the component and system level and more.

Increasing HVAC System Efficiency with Heat Pump Systems: Part 1

Tune into our webinar and dive into the fundamentals of heat pump system operation and learn how to implement heat pump designs that maximize system efficiency while lowering solution size and cost.

Space-grade solutions for next generation satellite communication payload designs

Do you want to bring your satellite communication payload design to the next level? Learn how to benefit from TI’s latest innovations and quality levels for easy adjustments of your platform for different mission profiles and cost targets.

How TI APIs can modernize your supply chain

Join us as we walk you through the TI store API suite and discuss API features you can leverage to simplify your semiconductor sourcing and purchasing journey.

Rapidly Develop with Low-cost MSPM0 MCUs

Learn how the new MSPM0 MCUs have pin-to-pin compatible options to match memory, analog and computing requirements, cost reductions at the component and system level without compromising performance.